IC Tray

• More than one thousand sets of IC tray molds to meet customers’ demands for all kinds of package types and sizes.
• Complying with JEDEC standards, professional product deign provides customers’ IC with best carrying and protection.
• Surface resistivity : 1×105~1×1012 ohms/square
• Package types : BGA, TFBGA, FCBGA, QFN, QFP, LQFP, TQFP, TSOP, SOP, SIP and CIS

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