Chip Tray

High-quality JEDEC tray solutions designed for semiconductor packaging, IC handling, component storage, and automated transport applications. Gennex provides reliable tray systems engineered for ESD protection, dimensional stability, and efficient semiconductor handling processes. Tray design conforms to JEDEC standard. Over 800 types of chip trays available. Standard 2″, 3″, 4″ outline dimension.

Type of Tray:

  • 2”, 3”, 4” Chip tray (COG)
  • Material : ABS

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Key Features of JEDEC Tray Systems

JEDEC tray systems are designed to meet semiconductor industry standards for safe component handling, automated processing, and reliable transport performance.

  • ESD-safe material protection
  • Industry-standard JEDEC compatibility
  • High dimensional stability
  • Durable and reusable tray construction
  • Automated handling system compatibility
  • Heat and chemical resistance options
  • Secure semiconductor component positioning

These features help ensure safe transport, improved operational efficiency, and reliable semiconductor packaging performance.

Request JEDEC Tray Solutions

Gennex can help design and support semiconductor packaging for your application — email semicon.rfq@gennexcorp.com for project discussion.

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Benefits of JEDEC Trays Solution:

  • Improved semiconductor protection
  • Reduced component handling damage
  • Enhanced automation compatibility
  • Better packaging efficiency
  • Reusable and cost-effective design
  • Improved inventory organization
  • Reliable transport and storage performance
Check Out More Semiconductor Packaging Solutions

JEDEC Tray Process & Packaging Workflow

Our chip tray solutions are designed to support structured semiconductor packaging and handling processes for industrial manufacturing environments.

  • Requirement Evaluation – Understanding component dimensions, handling requirements, and packaging conditions.
  • Tray Configuration Selection – Choosing suitable JEDEC tray specifications based on semiconductor device size and application needs.
  • Packaging & Integration – Implementing tray systems into semiconductor transport, storage, and automation workflows.
  • Handling & Protection Support – Ensuring safe component positioning, ESD protection, and efficient handling during production and shipment.

This process helps improve packaging reliability and semiconductor handling efficiency.

Applications of JEDEC Tray Solutions

Semiconductor device packaging
Automated manufacturing systems
SMT and assembly operations
IC and chip handling
Semiconductor storage applications
ESD-sensitive device protection

Partner with Gennex for JEDEC Chip Tray Solutions

Gennex provides reliable tray systems designed for semiconductor packaging and electronics manufacturing applications requiring secure component handling and dependable performance.

  • High-quality semiconductor tray solutions
  • ESD-safe protection for sensitive devices
  • Reliable compatibility with automated systems
  • Durable and reusable tray construction
  • Suitable for semiconductor and electronics industries
  • Expert support for tray selection and application requirements
  • Trusted solutions for semiconductor packaging operations

With Gennex, businesses gain access to dependable JEDEC tray solutions built for semiconductor protection, operational efficiency, and long-term packaging reliability. Email semicon.rfq@gennexcorp.com for your tailored solutions. 

FAQs About JEDEC Tray Solutions

A JEDEC tray is used for the safe handling, storage, transport, and automated processing of semiconductor devices, ICs, and electronic components during manufacturing and packaging operations. It helps protect sensitive components from physical damage and electrostatic discharge (ESD). Gennex can help provide suitable JEDEC tray solutions for your semiconductor applications, and you may contact semicon.rfq@gennexcorp.com for assistance.

JEDEC trays are commonly manufactured using durable plastic materials with ESD-safe properties designed to withstand heat, chemical exposure, and repeated handling in semiconductor manufacturing environments. Gennex can help recommend suitable JEDEC tray materials based on your application requirements, and you may email semicon.rfq@gennexcorp.com for assistance.

Yes, JEDEC trays are designed to comply with industry-standard dimensions and specifications, making them compatible with automated pick-and-place systems, robotic handling equipment, and semiconductor production lines. Gennex can help provide JEDEC tray solutions compatible with your automation systems, and you may contact semicon.rfq@gennexcorp.com for inquiries.

Important factors include component size, ESD protection requirements, material durability, heat resistance, automation compatibility, and tray dimensional specifications for your manufacturing process. Gennex can help assess your requirements and recommend the right JEDEC tray solution, and you may email semicon.rfq@gennexcorp.com for inquiries.

Gennex offers end-to-end semiconductor packaging and handling solutions for electronics and semiconductor manufacturers. We provide high-quality JEDEC trays, chip trays, IC trays, and related packaging solutions with reliable supply support across India, Thailand, Philippines, Malaysia, and Singapore.

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